(June 8, 2007) SAN JOSE, CA and CHANDLER, AZ — Oleg Khaykin, chief operation officer (COO) and executive VP of Amkor Technology, Inc., will keynote the International Wafer-level Packaging Conference (IWLPC), September 1719 in San Jose. The event, co-sponsored by the SMTA, also hosts workshops, panels, and technical presentations.