ASM service to facilitate successful MEMS packaging

June 21, 2007 – Recognizing that packaging and manufacturing are among the most crucial challenges facing MEMS engineers, ASM International has announced its MEMS Materials Database: Packaging Module to facilitate materials selection for MEMS packages.

Advances in packaging MEMS for manufacturability and ease-of-use have not matched advances in the devices themselves. Most MEMS require custom packaging solutions, and material selection is critical. MEMS packaging challenges addressed by the new database include: cost, size, package stresses and mechanical protection, electrical shielding and isolation, optical and thermal protection, chemical isolation, and overall hermeticity.

The database promises to help MEMS developers to:

+ Search, select, and report features to find and compare candidate materials.
+ Identify materials that optimally satisfy various mechanical and performance design requirements.
+ Select materials based on demonstrated successful application and compatibility with design parameters.
+ Create reports that compare materials and processes per user-defined criteria.

The MEMS Materials Database represents the first ASM product developed for the MEMS community. Licensing fees start at $89.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.