BASF, IBM to make 32nm IC materials

June 25, 2007 – BASF and IBM have signed a joint development agreement for electronic materials to be used in 32nm IC manufacturing by 2010, leveraging IBM’s semiconductor process development and BASF’s expertise in chemicals and nanotechnology. Research will be done in IBM’s facilities in Yorktown Heights, NY, and BASF’s headquarters in Ludwigshafen, Germany.

“Chemistry will increasingly play an important role in the development of the next-generation (32nm) IC products,” and the BASF partnership brings in “extensive and interdisciplinary background that only a major chemical company can offer,” said Ronald Goldblatt, Distinguished Engineer and senior manager, IBM Research, in a statement.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.