Dense CNTs Viable 3D Interconnects

(June 14, 2007) TROY, NY &#151 As part of research designed to manufacture carbon nanotubes (CNTs) as viable replacements for copper in 3D die-stacking applications, researchers at Rensselaer Polytechnic Institute have implemented a method for compacting CNTs into bundles, enabling better thermal and electrical conductivity. Densification occurs post-growth, allowing scientists to use a known, conventional CNT growth process. CNT density was increased 5–25&#215 in the experiments. James Jiam-Qiang Lu, associate professor of physics and electrical engineering, led the R&D.


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