MagnaChip: “CUP” structure cuts chip size by 30%

June 21, 2007 – Korean IDM MagnaChip Semiconductor Ltd., the former nonmemory business of Hynix Semiconductor spun off in 2004, says it has applied circuit-under-pad (CUP) technology to its foundry business processes for image sensor, mixed-signal, and digital multimedia components.

CUP places the I/O circuit on the unused area of a chip, under the pad, and can reduce semiconductor sizes without reducing I/O count. The company says using CUP for its 0.18-0.16-micron process shrinks chip size by 30%.

The CUP application will be extended to other processes, according to Channy Lee, EVP and GM of MagnaChip’s specialty manufacturing service (SMS) business. The technology will enable MagnaChip’s foundry-service and global partners to design smaller chip sizes as well, he added, noting that fabless companies can use the CUP chips to reduce costs/wafer.

Additional reporting by Advanced Packaging.


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