MagnaChip Implements Circuit under Pad

(June 21, 2007) SEOUL, South Korea &#151 MagnaChip Semiconductor Ltd. has applied circuit under pad (CUP) technology to its foundry business processes for image sensor, mixed-signal, and digital multimedia components. CUP places the I/O circuit on the unused area of a chip, under the pad, and can reduce semiconductor sizes without reducing I/O count.


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