June 8, 2007 — Helsinki, Finland-based Okmetic Oyj, supplier of silicon wafers for MEMS sensors, reports that it has transferred new highly homogeneous silicon on insulator (SOI) products into production. According to Okmetic’s Senior VP of Product Development Jaakko Montonen, the best tolerances available through bonding is +/-0.5micrometers. But, he claims, “we’ve developed the next-generation product with +/-0.3 micrometer device layer thickness tolerance in 150 mm — based on nine points measurement.”
Montonen explains that the highly uniform new material enables a completely new sensitivity level of MEMS components. In addition to enabling high-end devices, MEMS optimized silicon material is the key for narrow deviations and consequently for improved yield.
“We believe that related to thickness tolerance further improvement is still to be seen even based on current technology base”, says Montonen.
Okmetic focuses on manufacturing and further processing high-quality silicon wafers for the sensor and semiconductor industries. The company has plants in Vantaa, Finland and in Allen, Texas.