SEMI publishes six new technical standards

Documents include guidelines for FPD manufacturing, SOI wafers

June 11, 2007 — SAN JOSE, CA — SEMI has published six new technical standards applicable to the semiconductor, flat-panel display (FPD), and MEMS manufacturing industries. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers, and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI web site,

SEMI Standards are published three times a year. The new standards, part of the June 2007 publication cycle, join more than 740 standards that have been published by SEMI during the past 34 years.

“These new SEMI standards, which include specifications for the flat-panel display (FPD) manufacturing industry, are the result of collaborative, consensus-driven efforts among industry experts — competitors and customers alike — to manage the ever increasing manufacturing challenges, improve yield and ensure compatibility of equipment and processes worldwide,” says Bettina Weiss, SEMI director of International Standards.

The standards released today include specifications for bar code container identification, specifications for silicon-on-insular (SOI) wafers, and a test method for surface hardness of FPD polarizing film. In addition to the six new standards, SEMI revised a previously published standard on EHS guidelines for exhaust ventilation of semiconductor manufacturing equipment. The revised SEMI S6 offers significantly more detailed guidance and provides equipment suppliers, evaluators, and users a means of validating the adequacy of exhaust ventilation.

The new standards released today include:
– SEMI C61 — Specification for Bar-Code Container Identification
– SEMI D49 — Specification of Single Substrate Orientation for Loading/Unloading Into/From Equipment to Specify ID Reader Position
– SEMI D50 — Test Method for Surface Hardness of FPD Polarizing Film
– SEMI E148 — Specification for the Definition of Time Synchronization Method and Format
– SEMI E149 — Guide for Documentation Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment
– SEMI M71 — Specification for Silicon-On-Insulator (SOI) Wafers for CMOS LSI 130 nm Technology Generation and Beyond

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly, and packaging, in addition to the manufacture of flat-panel displays and microelectromechanical systems (MEMS). About 1,100 volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit for further details about SEMI Standards.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nanoscaled structures, microelectromechanical systems (MEMS), and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (CA), Seoul, Shanghai, Singapore, Tokyo, and Washington, DC. For more information, visit

Bettina Weiss/SEMI Scott Smith/SEMI
Tel: 408.943.6998 Tel: 1.408.943.7957
E-mail: [email protected] E-mail: [email protected]


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