ST, Freescale push embedded flash for autos

June 21, 2007 – Freescale Semiconductor and STMicroelectronics say they have “made significant progress” in joint design efforts targeting automotive MCUs based on Power Architecture technology, saying samples of 90nm embedded flash test chips are being validated now “showing very good results” and will available to lead customers by 1Q08.

The companies also said they are working to roll out four new products next year, followed by “a comprehensive roadmap” for scalable microcontroller designs in the next couple of years. A recent milestone, the companies indicated, has been delivery of a common microcontroller architectural platform design, which enables multiple products to be derived simultaneously using optimized peripheral sets.

Marco Maria Monti, VP and GM of ST’s powertrain and safety division, indicated the partnership aims to offer “a fully scalable roadmap from very cost-effective flash-based MCUs for car body applications up to very high-performance products for advanced powertrain and chassis systems.”

Work is ongoing at design centers in Italy, Brazil, and India, utilizing a total of 130 design engineers, the companies said in a statement.


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