Synova, Disco Co-develop Hybrid Dicing Tool

(June 11, 2007) LAUSANNE, Switzerland and MUNICH, Germany &#151 Synova and Disco Hi-Tec Europe GMBH will partner to develop a hybrid dicing tool that uses both Synova’s Laser Microjet (LMJ) water-jet-guided laser technology and the latest-generation blade-saw dicing systems for advanced dicing applications. The resulting tool is expected to allow semiconductor manufacturers to achieve a high throughput while minimizing damage to silicon and advanced-material wafers of any thickness.


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