MEMS structure with up to 1:30 aspect ratio made possible by DRIE (Photo: Tronics Microsystems)

June 7, 2007 — Two French companies, Tronics Microsystems SA, manufacturer of custom MEMS components, and Alcatel Micro Machining Systems (AMMS), manufacturer of deep reactive ion etching (DRIE) systems for MEMS and 3D semiconductors, have announced a joint development project on DRIE for extreme-performance MEMS.

The collaboration will leverage the partners’ complementary strengths to produce next-generation advanced DRIE process technology for high-performance MEMS and, the partners say, to “establish a new performance benchmark for the MEMS industry.”

AMMS is known for its high-speed deep plasma etching systems. Tronics has developed test tools and methodologies for tracking process-failure modes and has established precise statistical process control (SPC) indicators for MEMS production. Tronics is also known for applying advanced DRIE on thick SOI micromachining technologies for manufacturing high-performance custom sensors and actuators.

Tronics will use its test protocols to evaluate and qualify new, advanced DRIE manufacturing processes from AMMS, and will provide SPC feedback. With that data, AMMS will build on its DRIE leadership by further enhancing its process solutions for new, advanced high-aspect-ratio, high-yield and manufacturing-proven processes. In return, Tronics will receive priority access to the company’s latest process modules and quality services.