July 25, 2007 — Advanced Diamond Technologies, Inc. (ADT), known for developing and applying diamond films for industrial, electronic, and mechanical applications, has unveiled new varieties in its product line of diamond coated wafers for accelerating the development of MEMS and electronic devices.

ADT’s new products include Diamond on Insulator (DOI) wafers, an extension of its Diamond on Silicon (DoSi) wafers made from the vapor deposition of ADT’s phase-pure ultrananocrystalline diamond (UNCD) on silicon wafers.

UNCD DOI wafers serve as platforms to test device concepts and develop processes to enable wafer-scale diamond applications across a broad spectrum of products including MEMS and electronics. ADT’s advancement, at last, makes diamond an engineering material suitable for volume production of many types of devices.

“We believe that a reliable supply of our commercial grade diamond coated wafers will stimulate the development of diamond MEMS and electronic devices,” said ADT president Neil Kane.

ADT also announced the award of a Phase I Small Business Innovation Research (SBIR) grant from the National Science Foundation (NSF) for the development of Starter Wafers for Diamond MEMS Fabrication.”This project allows us to further expand the UNCD DOI product line by demonstrating the integration of other common MEMS materials such as metals, nitrides, and complex oxides with UNCD. We will show that diamond wafers with outstanding uniformity can be manufactured in sizes up to 200 mm and meet MEMS foundry standards for cleanliness and reproducibility,” said ADT chief technical officer Dr. John Carlisle.