AMS uncrates metrology systems for 3D, Cu/low-k stacks

July 19, 2007 – Advanced Metrology Systems (AMS, formerly Philips AMS) has released three new metrology tools this week, offering model-based infrared (MBIR) metrology for 3D DRAM structures, and a surface wave system for multilayer measurements of copper/low-k films stacks.

The IR 3100N, a follow-up to the 3100 series released earlier this year, uses an extended near infrared (NIR) measurement for online, highly automated measurements of shallow recess structures on product wafers with 70nm and below process technologies. The IR 3100S incorporates a proprietary optical measurement system to achieve spot size of <70 x 70 microns, allowing product chemometrics such as BPSG monitoring as well as increased resolution for 3D etch structures, the company says.

Also unveiled this week is AMS’ SW3300A, a “significant improvement” to the company’s SurfaceWave family, which uses proprietary multi-acoustic wavelength data collection and multiple acoustic parameter algorithms to provide multilayer measurements of copper/low-k interconnect structures. “The ability to measure at multiple acoustic wavelengths coupled with our fourth generation multiple parameter models enables us to now measure multiple layer properties,” noted Tony Bonanno, AMS director of product development, in a statement.


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