Brewer, EVG Collaborate for Thin-wafer Bonding

(July 18, 2007) ST. FLORIAN, Austria and ROLLA, MO &#151 EV Group partnered with Brewer Science, Inc., to introduce a bonding system that handles ultra-thin wafers. The jointly developed technology performs temporary bonding between standard wafers and rigid carrier wafers, then wafer thinning and back-side processing are performed on the wafer stack.


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