CEA Installs Alcatel Systems for TSVs

(July 23, 2007) GRENOBLE and ANNECY, France &#151 Alcatel Micro Machining Systems will provide two 200-mm deep reactive ion etch (DRIE) and low-temperature plasma-enhanced chemical-vapor deposition (LTPE CVD) systems at CEO/L&#233ti-Minatec R&D institute under a joint development agreement. The parties will collaborate to develop and demonstrate a suite of turnkey silicon microvia technologies for 3D integration at wafer and die levels.


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