CEA/Leti-Minatec and Alcatel to co-develop 3D interconnect processes

July 24, 2007 — CEA/Leti-Minatec, a European R&D institute specializing in advanced microelectronics, and Alcatel Micro Machining Systems, manufacturer of deep reactive ion etch (DRIE) equipment for the MEMS and semiconductor industries, will collaborate to develop industrial process capability in DRIE and LTPECVD for 3D interconnect applications. The collaboration addresses the trend that advanced packaging technologies and chip stacking techniques play an increasing role in the evolution of microelectronics and microsystems.

CEA Leti-Minatec intends to expand its capabilities in 3D integration to include thru-wafer micro vias to allow dense interconnect on both sides of chips. Considering the importance of deep anisotropic etching of silicon and via isolation to the success of the technology, CEA-Léti Minatec will accelerate development by joining efforts with Alcatel Micro Machining Systems, which it calls the world leader in DRIE equipment. The two-year program leverages capabilities made possible by the installation of two new 200mm Alcatel machines for DRIE of silicon and LTPECVD of low temperature oxide isolation. The partners expect to develop and demonstrate a suite of turn-key solutions for integration in advanced electronic systems.

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