IBM Ramps C4NP in NY Facility

(July 19, 2007) EAST FISHKILL, NY &#151 IBM installed its first controlled collapse chip connection new process (C4NP) production line in East Fishkill, ramping for lead-free solder bumps on cost-sensitive semiconductor packages. The manufacturing line, supplied by SUSS MicroTec (Munich, Germany) comprises mold-fill, inspection, and transfer steps. “C4NP offers lower-cost bumping with improved quality, and suits lead-free, cost-sensitive consumer products,” said Barry Hochlowski, product manager, C4 bump and test. IBM is turning out products for gaming systems using C4NP packaging.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.