ICOS introduces automated 300mm wafer handling system

July 18, 2007 – ICOS Vision Systems Corp. NV, Leuven, Belgium, has introduced its new HM-300 automated wafer handling system for 300mm wafers at the SEMICON West trade show. Key market segments for the new product are semiconductor ICs, optoelectronics, advanced packaging, and MEMS.

“The HM-300 is fully compatible with our existing product range of inspection systems for 2D/3D bump metrology and surface inspection up to 200mm wafers. It also features our unique design of modular and exchangeable handlers and inspection tools,” said Anton De Proft, ICOS’ president and CEO.


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