SST names ACA recipients for CoO, innovation, problem-solving

Last night SST named the winners of our fifth annual Attendees Choice Awards at SEMICON West, spotlighting companies’ technologies on both the wafer processing and final manufacturing sides of the fab that customers voted as the industry’s best in terms of innovation, cost-of-ownership, and best solution to a problem.

Without further ado, the winners are:


Best cost-of-ownership: Olympus Micro-Imaging, LEXT OLS-3100 laser scanning microscope

The LEXT OLS-3100 laser scanning microscope is a 408nm laser-based confocal microscope for nondestructive imaging and measurements of submicron surface structures. No sample preparation or complicated training is required to achieve high-resolution images with magnifications as high as 14,400x. The system’s technology features submicron imaging with accurate 3D measurement capability. The LEXT provides resolution of 120nm laterally and 20nm in z. Measurements provided include linewidth, step height, roughness, particle analysis, and thin-film measurement. In addition, the LEXT OLS-3100 provides the features of a standard white-light microscope including bright field, dark-field, and DIC imaging. The OLS-3100 can accommodate specimens with dimensions of 100mm x 150mm with 300mm systems available on request. Olympus Micro-Imaging, Orangeburg, NY, United States; ph 866/642-4725, e-mail [email protected],

Most innovative product: FEI Co, Expida 1255S defect characterization system

The Expida 1255S system for applications including defect characterization, failure analysis, and transmission electron microscope (TEM) sample preparation, extends the capabilities of the Expida family through improvements to the Sirion electron column and the addition of an integrated 14-segment scanning TEM (STEM) detector for 30kV STEM imaging. The system integrates sample lift-out and handling to support these new features, reportedly shortening the time required to go from full-wafer samples to high-contrast, high-resolution images and analysis. In addition, the Expida 1255S system assures correct end pointing and guaranteed lamella thickness by enabling STEM imaging while milling the TEM sample to its final location and thickness. FEI Company, Hillsboro, OR, United States; ph 503/726-7500, e-mail [email protected],

Best solution to a problem: Olympus Integrated Technologies America Inc., FR3200 broadband UV defect review system

The FR3200 broadband UV defect review system has BF, DF, DIC, and confocal visible observation modes. The integration of new multiband UV optics provides high-resolution observation at four UV wavelengths through a single high-power microscope objective. This design allows observation using any single UV band or any combination of UV bands that can penetrate surface layers to see subsurface defects in pseudo color. This flexible multiple band UV observation method can reportedly provide faster characterization of advanced materials defects on all layers. The system has multiple observation modes, reported higher throughput than previous systems, compact footprint, and flexible application software. Olympus Integrated Technologies America Inc., San Jose, CA, United States; ph 408/514-3900, e-mail [email protected],


Best cost-of-ownership: SUSS MicroTec S.A.S., KADETT high-accuracy placement and bonding system

The KADETT high-accuracy placement and bonding system fits R&D laboratories and pre-production environments with semi-automatic operation and a flexible platform accepting a range of substrates. The machine comprises a pick-and-place function and bonding processes including in situ reflow, thermo-compression, thermo-sonic and adhesive bonding with forces up to 75N. The x3-micron alignment is directed by a vision system with independent, high-resolution video microscopes on the chip and substrate, and a 0.1-micron resolution X/Y alignment stage. SUSS MicroTec S.A.S., Saint-Jeoire, France; ph 33/45035-8392, e-mail [email protected],

Most innovative product: Tessera Technologies Inc., Shellcase RT wafer-level chip-scale packaging technology

Shellcase RT, a wafer-level chip-scale packaging (WLCSP) technology, targets OEMs and camera-module manufacturers building lower profile camera modules for camera phones, PDAs, laptops, and automotive-based electronics. It leverages existing assembly processes and infrastructure and supports lead-free production. The technology incorporates polymeric-encapsulated glass-silicon structures, wherein the wafer is encapsulated with a glass cover at the initial stage of processing; electrical contacts are routed to the wafer backside where solder bumps are formed. The wafer is singulated into individually packaged dice in both cavity and non-cavity formats. At approximately 0.5mm thickness, the platform accommodates scribe lines down to 100-micron, smaller bond pads, and pitches down to 180-micron. It achieves 2000 cycles and thermal temperature ranges of -40-125


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