July 11, 2007 – Nikon Precision Inc. has released two new DUV lithography scanners, built on its Tandem Stage platform, to improve productivity and enhance overlay performance.
The S310F ArF 193nm wavelength scanner targets high-volume manufacturing of 65nm or smaller devices, with throughput increased 20% to 174 wafers/hour over the previous tool version. The tool offers down to 7nm overlay, 0.92NA optics, and Nikon’s fourth-generation POLANO polarization control system, plus infrared aberration control.
The S210D KrF 248nm system (NA=0.82) enables patterning layers down to 110nm, with 176 wafers/hour throughput (20% better than the previous system) and 9nm overlay accuracy, Nikon says.
Having all of its litho scanners on its Tandem Stage platform enables manufacturing efficiencies, reduces cost over time, standardizes software across platforms, and simplifies field support, and will also reduce tool installation time, the company claims.