July 18, 2007 — Ormecon, an established supplier of immersion tin PCB surface finishes, has released its new Organic Metal Nanofinish, a new solderable surface finish for printed circuit boards. Just 50 nanometres thick, Nanofinish consists of less than 10% silver and more than 90% Ormecon’s proprietary organic nanometal.

Nanofinish’s performance and thermal aging resistance is said to be superior to any metal or OSP finish. The company says it is in use by renowned market players such as Flextronics. The new process consumes less than 10% of the energy compared to other metallic finishes, and promises to save more than 90% of (expensive and partially noble) raw materials, says Omecon.