SEMI names 2007 standards award recipients

July 19, 2007 – A handful of industry executives were recognized this week by SEMI for contributions to standards development for the semiconductor and related industries.

Kazuko Ikeda, who led the Japan Silicon Wafer Committee from 1995 to 2006 overseeing development of 300mm wafer specifications and other related standards, and also served on the Japan Regional Standards Committee, received SEMI’s Karel Urbanek Memorial Award, SEMI’s highest Standards honor. Its namesake, the late Karel Urbanek, was co-founder of Tencor Instruments and helped lead the SEMI International Standards program.

“We are pleased to recognize the great efforts put forth by Ikeda-san for her tenacity in helping to coordinate JEITA and SEMI standards activities,” said Stanley Myers, president and CEO of SEMI, in a statement. “Her work has been instrumental in enabling SEMI to become a truly global organization for the worldwide semiconductor industry.”

Others receiving kudos from SEMI this week for their standards work included:

– George Celler, SOITEC USA: The Merit Award, presented to a standards volunteer for making a major contribution to the semiconductor industry through the SEMI Standards program;

– Dave Walsh, Standards Technology Group: The Technical Editor Appreciation Award, given in recognition for yeoman service done by individual standards volunteers;

– Frank Flowers, FMC: The Leadership Award, given to an individual for providing outstanding leadership in guiding the SEMI Standards Program;

– Harvey Wohlwend, ISMI: The Corporate Device Member Award, presented to an individual acting (officially or unofficially) as corporate representative from a device manufacturer for outstanding contributions to the development of SEMI Standards; and

– Rob Henry, Thermo Fisher Electron, and Stephen Sumner, Entegris: The Honor Award, presented to an individual who has demonstrated long-standing dedication to the advancement of SEMI Standards.

SEMI’s Standards Program, established in 1973, incorporates 17 global technical committees and ~1500 volunteers worldwide, covering all aspects of semiconductor manufacturing (process equipment and materials, wafer manufacturing, test, assembly and packaging) as well as flat panel displays and micro-electromechanical systems (MEMS).


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