SST ON THE SCENE: R&D effectiveness needs collaboration; unresolved 45nm/32nm metrology issues

In video interviews at SEMICON West, Dave Gross of AMD pleads AMD’s case for collaboration to maximize the effectiveness of R&D dollars. Alain Diebold (U. at Albany) summarizes unresolved metrology issues at 45nm and discusses the future at 32nm. And John Allgair (ISMI assignee from AMD) outlines the group’s current plans as it gears up for a larger presence in Albany and expand its metrology program — look for intentional defect array wafers to be ready for mass production in 2-3 months.

Dave Gross, director, global manufacturing systems technology, 300mm engineering, AMD
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– (SEE ALSO: SEMICON WEST REPORT: Do lean principles apply to semi manufacturing?)



Alain Diebold, Empire Innovation Professor of Nanoscale Science, College of Nanoscale Science and Engineering, U. at Albany
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John Allgair, metrology program manager, AMD assignee to the International SEMATECH Manufacturing Initiative (ISMI)
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More “SST on the Scene” video interviews from SEMICON West…

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