SUSS Device Bonders Bought Out

(July 27, 2007) SAINT-JEOIRE, France &#151 SUSS MicroTec France’s president, Ga&#235l Schmidt, used a management buy out (MBO) agreement to acquire SUSS MicroTec’s device bonder division. He will rename the company Smart Equipment Technology (S.E.T.); S.E.T. will operate as a simplified joint stock company with about €40,000 ($55,000) capital.


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