SUSS launches, ships 300mm SOI bonding system

July 18, 2007 – Today at SEMICON West, SUSS MicroTec launched the ELAN CBC300SOI, its new 300mm SOI wafer bonding system, and said that it has already shipped the SOI bonding system to a leading manufacturer of SOI wafers.

At the core of the cluster tool is SUSS’ patented single-station bond technology, which allows for 300mm cleaning, aligning, and bonding to occur within a single process module. SUSS’ unique unibody dual-nozzle megasonic cleaner and programmable IR-assisted spin drying reportedly result in extremely clean wafers and controlled surface drying. Users can now control their clean and dry parameters very specifically, which is said to guarantee repeatable wafer bonding results.

The standard ELAN SOI system includes two single station bond modules, a high-resolution IR inspection module, a central material handling unit with a robust wafer handling robot and precise prealigner, and two FOUP loadports — all within a small cleanroom footprint.


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