TechXPOT Focus: Packaging Material Trends

By Fran&#231oise von Trapp, managing editor, Advanced Packaging

Material science has a firm foothold in the future of advanced packaging. At SEMICON West’s Wednesday, July 18, Packaging Materials Trends TechXPOT, sponsored by IMAPS, industry experts shared insights and developments in packaging materials, their applications, and how these innovations will help device packaging address functionality, form factor, and reliability challenges.


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