July 31, 2007 — /PRnewswire/ — ALLENTOWN, PA — Akrion, Inc., a supplier of semiconductor surface preparation equipment, recently received an order for a Velocity single-wafer cleaning system from a world leading manufacturer of semiconductor devices. The Velocity will be shipped to the logic and memory device manufacturer’s U.S. fabrication plant within the next 90 days. The system will be used for defect removal in the production of NAND flash devices. NAND flash is used for consumer products such as USB flash drives and for MP3 players.

Velocity is Akrion’s most advanced single-wafer platform. Its design uses controlled physical force technologies that assist ultra-dilute chemicals for critical defect removal applications. Velocity’s physical cleaning technology includes Goldfinger(R) megasonics for defect removal as well as JetStream-Nano(TM) spray which can be combined with the megasonic for an additional cleaning advantage. Other available technologies include chemical micro-dispense for very low chemical usage and the Sahara(TM) watermark-free surface tension gradient dryer.

In addition to configurations for sensitive structure defect removal, Velocity systems are available for both aluminum (Al) and copper (Cu) back-end-of-line (BEOL) post etch/ash cleaning and for front-end-of-line (FEOL) post ash cleaning applications.

About Akrion
Akrion is a provider of advanced surface preparation systems used in the manufacture of semiconductor devices. The company’s products, which include single-wafer and batch-immersion cleaning systems, are used in the production of a wide variety of semiconductor devices, including logic devices, analog devices, flash memory, DRAM and MEMS and are used to clean bare silicon and test wafers as well as photomasks. Headquartered in Allentown, PA, Akrion’s Allentown production facility is ISO 9001:2000 and ISO 14001:2004 certified. For further information, please visit Akrion’s Web site: http://www.akrion.com/.

Source: Akrion, Inc.