DoD Supplements EI’s MCM Contract

Fulfilling sustained performance, reliability, and cost targets gained EI the contract modification, said Eric Hills, director of military and defense programs, EI. EI places semiconductor dice, logic, and prepackaged memory along with passive components on its proprietary organic substrate, then attaches a heat spreader and pin connector to form the MCMs. EI purchased a supplemental flip chip packaging line, comprising screen printer, placement systems, a reflow oven, and automated optical inspection (AOI) tools to enable production on the augmented contract.

(August 22, 2007) ATLANTA &#151 Jacket Micro Devices (JMD) patented a fabrication method for 3D, all-organic interconnect structures that uses high- and low-temperature single-sided liquid crystal polymer (LCP) structures. The technique is based on JMD’s multi-layer organic (MLO) packaging portfolio.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.