IPC Studies Global Development, Microelectronics

“Where in the World? A Geographic Guide to Investing for Long-term Business Growth in the Electronic Interconnect Industry,” compiled by BPA, will provide a primer on economic, social, legislative, educational, logistic, and technical resources for key regions and countries. It will forecast the development path of select areas, scrutinizing infrastructure development, industry capability growth, and investment by industry sector.

(August 21, 2007) ENDICOTT, NY &#151 The U.S. Department of Defense (DoD) awarded Endicott Interconnect Technologies, Inc. (EI), a $19 million contract modification to existing work, requiring additional multi chip module (MCM) assemblies and equipment. EI provides fully assembled MCMs for a high-reliability, high-performance DoD computing application.


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