JMD Launches 3D Via Processes

Stacking vias with JMD’s process creates 3D LCP interconnect structures with a high-temperature, single-sided LCP and a low-temperature, single-sided LCP, which are both drilled in a laser or mechanical step. This results in a z-axis via in the homogenous organic material.The 3D interconnections in homogeneous organic materials enable complex, multi-layer and vertical, circuit patterns and higher-density interconnects in passive components, said George White, Ph.D., chief technology officer (CTO), JMD, who referred to the method as “any layer, any via.”

(August 22, 2007) WATERVLIET, NY &#151 The Forschungszentrum Karlsruhe independent science and research institute (Germany) began running applications on a Vistec VB6 electron beam lithography system in its Karlsruhe Nano Micro Facility. The system will allow researchers to develop new applications in nanotechnology and microsystems technologies.


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