Rohm and Haas Receives SMIC Excellent Supplier Award

In addition to front-end materials such as polishing pads, slurries, and pad conditioners for CMP, Rohm and Haas supplies SMIC with electroplating processes for wafer bumping and under bump metallization, photoresists and anti-reflectants used in lithography, and ion exchange resins used to produce ultrapure water needed in semiconductor manufacturing.

(August 29, 2007) DURHAM, NC &#151 In a move to reduce form factor while increasing power of its UHF power amplifiers, MILMEGA Ltd. has chosen Cree silicon carbide (SiC) MESFETS to power its new line. Cree’s SiC MESFETs are said to provide greater power density than conventional semiconductor materials, allowing for improved efficiency and more capabilities in a smaller form factor.


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