Surfect launches wafer-bumping service

August 23, 2007 — Surfect Technologies says it has launched a wafer bumping service program utilizing its single-cell electroplating process for 200mm and 300mm IC manufacturers and OEMs performing low-volume production, preliminary wafer-level packaging, R&D, or new product introduction (NPI), or evaluating wafer-bumping systems.

Wafer bumping is performed for standard and fine-pitch applications. Surfect offers Plating Computer for programmable interconnect formations that reportedly produce high-performance, lower-cost bumped wafers for high-value or time-sensitive products.

The service will develop into an additional revenue stream for the equipment manufacturer, said company CEO Steve Anderson, adding that it also allows prospective equipment buyers to try Ascent and Leapfrog bumping tools or augment existing manufacturing capacity.

Reporting by SST sister publication Advanced Packaging.


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