Wafer bumping is performed for standard and fine-pitch applications. Surfect offers its process-driven, software controlled Direct Energy Plating™ tool for programmable interconnect formations that reportedly produce high-performance, lower-cost bumped wafers for high-value or time-sensitive products. The bumping service allows Surfect to build a library of wafer-level plating process recipes, said Stephen Cho, CTO. These will then be available to customers that install the electroplating systems in their own facilities, he added.
(August 23, 2007) WILMINGTON, MA — Quantum Leap Packaging, Inc. (QLP), purchased a second manufacturing site, located in Poway, CA. It plans to manufacture high-performance air-cavity packages at the Poway site by early 2008.