TSMC producing 0.13-micron embedded flash

August 21, 2007 – TSMC says it has qualified and begun production of its “fully logic compatible” 0.13-micron embedded flash process, the first version to use copper wiring.

The process incorporates copper wiring, which TSMC characterized as a “smooth transition,” and employs the previous processes’ split-gate flash cell. The foundry says the new process, compatible with its logic baseline of 0.13-micron general purpose and low-power processes, targets applications requiring ultralow power consumption (1.2-1.5V) such as ZigBee/Wibree devices, wireless headsets, hearing aids, and smart cards.

TSMC rival UMC is also working on 0.13-micron embedded flash with customer Cypress Semiconductor.

Also, Freescale Semiconductor and STMicroelectronics recently said they’re making “significant progress” with their 90nm embedded flash test chips for use in automotive MCUs, with validated samples expected to ship to customers by 1Q08.


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