Wafer-bump, LED Cluster

An advanced coating cluster, the Gamma XPress suits gold bump coating, under bump metallization or redistribution coating, high-volume LED coating, and other film-development applications based on chosen configuration. It is said to shorten lead times with flexible production setup.

EasyPro3D hosts simplified parameterizing; an IPC-compliant, 1,600 component library, LIB2007; and updated repair station. The shortened parameter list reportedly speeds high-quality inspection with low false calls, while automatic parameter optimization (APO) allows use with all LIB2007 algorithms.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.