ASE, Mitsui Collaborate for Hybrid Packaging

(September 6, 2007) SANTA CLARA, CA &#151 Advanced Semiconductor Engineering Inc. (ASE) and Mitsui High-tec Inc. (Kitakyushu, Japan) signed a multi-year cross-licensing agreement to design and make hybrid manufacturing technologies (HMT), with each side sharing intellectual property (IP) rights and technical expertise. The deal centers on Mitsui’s HMT technology, a JEDEC/JEITA standards-conforming, copper leadframe-based area array package that offers a reportedly more flexible footprint than a multi-row QFN.


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