ASE, Mitsui collaborating on hybrid packaging

September 6, 2007 – Advanced Semiconductor Engineering Inc. and Mitsui High-tec Inc. have signed a multiyear (minimum five years) cross-licensing agreement to design and make hybrid manufacturing technologies (HMT), with each side sharing IP rights and technical expertise. Financial terms were not disclosed.

The deal centers on Mitsui’s HMT technology, a JEDEC/JEITA standards-conforming, copper leadframe-based area array package that offers a more flexible footprint than a multi-row QFN, as well as advantages in terms of thermal, electrical, reliability, and costs vs. similar laminate packages, the companies explained.

“Our HMT technology has been well-received within the industry, therefore it makes sense to work together with industry leader ASE to strengthen the technology, increase market adoption, and accelerate the development of the companies’ current and future product lines,” said Yasunari Mitsui, VP at Mitsui High-tec, in a statement.


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