September 11, 2007 – Aviza Technology Inc. and Mosel Vitelic Corp. have signed a pact to jointly develop advanced atomic layer deposition (ALD) materials for next-generation flash applications.
Under terms of the deal, Aviza will provide ALD hardware (its Celsior fxP single-wafer tool) and process expertise for materials development, with Mosel Vitelic offering device design and process integration, to develop the ALD films. Using ALD enables deposition of new materials to ensure improved device performance, lower leakage, and efficient power consumption, a spokesperson explained to SST.
The work will focus on producing advanced films for advanced flash memory devices (58nm structures and below) with higher densities, lower cost and faster programming, as well as a smaller device footprint, for use in leading-edge consumer devices. The Aviza spokesperson noted that the JDP signifies taking ALD outside the DRAM market and into flash, from which it will eventually move over to logic devices to address continued IC device scaling.
“Aviza is focused on further developing ALD process and technology solutions specifically for the flash and logic markets, and this JDP is another example of our efforts to meet this objective,” said May Su, VP and GM of Aviza’s ALD and thermal business unit, in a statement. “Early collaboration is key and we believe that working with MVC will mutually benefit both companies and accelerate the development of advanced ALD films.”