ChipMOS sues Walton over BGA patents

September 5, 2007 – ChipMOS Technologies’ Taiwan division has filed suit against domestic firm Walton Advanced Engineering Inc. alleging infringement of ball-grid array package-related patents used in DDR2 SDRAM devices.

The firm says it has obtained “several branded memory modules packaged by Walton” from the retail market, sent by “a professional appraisal institution,” which concluded that the package device infringed two patents relating to substrates on a SoC packaging process.

The suit seeks $454,000 in monetary damages “at the initial stage” for losses suffered, as well as a court order prohibiting Walton from using the alleging infringing technology.


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