Hysol QMI708 targets applications with copper leadframes and small footprints. It was developed to attach 2.5- × 2.5-mm and smaller die in QFN and SOIC packages.
Hysol QMI708 targets applications with copper leadframes and small footprints. It was developed to attach 2.5- × 2.5-mm and smaller die in QFN and SOIC packages.
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