Flip Chip Metrology

The Wyko SP9900 surface-profiling optical metrology tool monitors height, yield, roughness, and other parameters of multilayer organic panels for pin grid array (FC-PGA) and ball grid array (FC-BGA) flip chip packaging. It offers faster measurement, increased sample access, and up to 600 &#215 600 mm panel measurement within the SP equipment footprint.

Performing quality assurance (QA), characterization, and small-lot production, the V5000ep builds on the V5000e platform with increased automation, testing and characterizing all memory types from wafer sort through final test. When testing multi-chip packages (MCPs), the system uses proprietary Matrix technology to automatically shift resources from one die to another without manual reinsertion of the device under test (DUT).


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