FlipChip International Names VP Sales and Marketing for WLP and Bumping Business

(September 25, 2007) PHEONIX, AZ&#151FlipChip International (FCI) announced the appointment of David McComb as global vice president, sales and marketing for its wafer level packaging (WLP) and bumping business. McComb, who joined FCI in 2005 as the director of European business and sales, will assume responsibilities for sales, marketing, and licensing for FCI’s activities for international customers.


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