By James Montgomery, contributing editor
(September 12, 2007) DANBURY, CT — Global packaging and testing (PAT) revenues are expected to grow at half the rate in 2007 that they did in 2006, and will improve marginally in 2008, according to new data from Gartner Dataquest. A closer look inside the numbers reveals the emergence of outsourced semiconductor assembly and test services (OSATS) providers, poised to balloon by nearly a third over the next three years and reach equal footing with integrated design manufacturers (IDMs).