Lam, Novellus take two paths to strip wafer edges

by Ed Korczynski, Senior Technical Editor

Silicon wafer edges induce inherent non-uniformities in processing, and also seem to be the main source of defects for immersion lithography. Cleaning/stripping the wafer edge (or “bevel”) is thus essential for production yield. Here follows a tale of two companies, two machines, and two different ways to solve the edge problem by dry stripping.


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