(September 4, 2007) MUNICH, Germany — SUSS MicroTec and Surface Technology Systems (STS) will bring their “MEMS Technology: Embracing the Future” Roadshow to Europe in September, following a five-city tour in the U.S. this April. The Roadshow event features presentations from SUSS, STS, Primaxx, and XACTIX, covering trends in wafer bonding, wafer-level test, and other manufacturing steps.