Users can perform plasma applications — preclean, surface activation, and coating — in parallel or in sequence with thermal steps — rapid thermal processes, reflow, and test. UniTemp and plasma-finish are targeting reflow solder bump with surface activation or cleaning, wafer processing with 650°C maximum temperature, and other process flows for the PTP.
(September 5, 2007) CORPUS CHRISTI, TX — IRC Advanced Film, a business of TT electronics, franchised Semi Dice (Los Alamitos, CA) as a global distributor for wire-bondable products. Semi Dice offered the component manufacturer a partner experienced in bare die and the semiconductor industry, said Steve Wade, director, sales and marketing, IRC.