September 27, 2007 – SanDisk Corp. has opened its flash memory assembly/test plant in Shanghai’s Zizhu Science Park, its first production facility in China, which will focus on system-in-package (SiP) chips.
The 34,000 sq. m site, “vertically integrated” with all test/assembly processes in house, is expected to meet approximately 30% of projected global demand for SanDisk’s SiP products, the company said in a statement.
Randhir Thakur, SanDisk’s EVP of technology and world wide operations, noted that the Shanghai site will produce some of the company’s “most technically sophisticated flash memory products,” including 4- and 8-memory-die stacks for mobile devices. SanDisk also plans to set up a locally based development team for new products, and will leverage ties to nearby universities for recruitment (Jiaotong U. and Huadong U.) and elsewhere in the Shanghai area.
“Shanghai is a strategic location that is close to our supply partners and allows us to stay ahead of the curve as we seek to bring our products to market faster,” stated Sanjay Mehrotra, SanDisk president and COO.