Seminar Series Targets Integrated Process Solutions for 3D Packaging

(September 25, 2007) MUNICH, Germany&#151 SUSS Microtec, NEXX Systems, and Surface Technology Systems (STS), manufacturers of semiconductor process equipment, announced their collaboration with Fraunhofer IZM to demonstrate integrated process solutions for 3D wafer-level packaging (WLP).

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.