A two-component epoxy adhesive, 40-3900 is filled with pure, non-alloyed silver in the resin and hardener. It is electrically conductive with electrical resistivity of less than 1 × 10-4 Ω/cm.
The epoxy tolerates operation from -50° to +170°C. It suits chip bonding in micro- and optoelectronic applications, as well as microwave electromagnetic interference (EMI) and radio frequency interference (RFI), or assembly and repair of electronic modules, connectors, and PCBs.