SUSS and partners plan 3-D MEMS packaging seminars

September 27, 2007 — SUSS MicroTec, NEXX Systems, and Surface Technology Systems (STS) have announced that they will collaborate with Fraunhofer IZM in a series of seminars to demonstrate integrated processes for 3-D wafer level packaging.

The first series, scheduled for October 26 through November 7, will be in Singapore, Japan, China, Korea and Taiwan. The seminars, targeted toward packaging industry professionals, will cover how to optimize integrated processes to enhance 3-D wafer level packaging performance and lower costs.


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